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4mil High Density Interconnect PCB Board Fabrication FR4 TG170

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4mil High Density Interconnect PCB Board Fabrication FR4 TG170

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Brand Name : Huashengxin

Model Number : 135464

Certification : UL , ISO9001

Place of Origin : China

MOQ : 1pcs

Payment Terms : T/T

Delivery Time : fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production

Packaging Details : vacuum

PCB Name : 4L 1+N+1 High-Density Interconnector PCB

Marterial : FR4 TG170

Surface finished : Immersion gold

Board Thickness : 2.0mm

Copper thickness : 1/1/1/1OZ

Min.PCB track/gap : 4/4mil

Solder mask : Green, two sides

Smallest Mechanical drilling hole : 0.2mm

Special requirement : impedance control/high TG

Applicationcommunications products : Communications products

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4mil High Density Interconnect PCB Board Fabrication FR4 TG170

HDI PCB Board PCB Prototype Board PCB Prototype Board HDI Board PCB Manufacturing Service FR4 PCB Board

4L 1+N+1 High-Density Interconnector Printed Circuit Boards


HDI stands for High-Density Interconnector. It is a special type of PCB that has the capability of high-density interconnections. It means that HDI boards has more wires or conduction lines per unit area, utilizing the most out of the space and offering a compact PCB.

HDI PCB has tightly packed interconnections, it saves a lot of space and offers more component density and it has the capability of making a circuit compact.

HDI boards are particularly attractive to portable, mobile, and portable electronics due to their slim, dependable performance and tiny size. HDI technology is a critical component of many of advanced technologies. The miniaturization of electronic components including PCBs has enabled manufacturers to produce smaller, more cost-effective devices without sacrificing performance or reliability.

They are largely used in Consumer Electronics, communication, Automotive and Aerospace,Medical Devices, and industry control products and other industries.

Circuit board Layer count: 4L Circuit board laminate: FR4 TG170
Layer Copper thick: 1/1/1/1OZ Board thickness: 2.0MM
Smallest hole size: 0.20mm Smallest PCB track/gap: 4/4mil
Solder mask color: TAIYO Green Silk screen color: White
PCB surface finished: Immersion Gold Board profile: Routing
PCB Board Application: communications
Requesting Special requirement: HDI Buried vias and blind vias, one step stack up /impedance control/high TG

4mil High Density Interconnect PCB Board Fabrication FR4 TG1704mil High Density Interconnect PCB Board Fabrication FR4 TG170

FAQ:
Q1:Could you provide PCB Assembly services and components sourcing?
A: Yes, we could also provide components sourcing and PCB Assembly services as well as box build if request.

Q2:Which countries have you worked with?
A:USA, Canada, Italy, Germany, UK, Spain, France, Russia, Iran, Turkey, Czech Republic,Austria, Australia, Brazil, Japan, India etc.

Q3:Will our PCB files be checked.
A: Yes. Your data will be checked by our Engineers Team. If we find any technical issues or have any inquires, we will contact you and solve the problems together.

Q4: Does our product will be tested before shipment.
A: Yes. We could provide Function Circuit Testing if you provide us the testing methods.

Q5:Which payment method do you accept?
A: Wire Transfer(T/T), Letter of Credit(L/C), or Paypal( Paypal is only for small value less than 500usd)


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