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OSP HASL Multilayer Ceramic PCB Circuit Board High TG FR4 ISO9001 Approved

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OSP HASL Multilayer Ceramic PCB Circuit Board High TG FR4 ISO9001 Approved

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Brand Name : Huashengxin

Model Number : ED9A8040

Certification : UL , ISO9001

Place of Origin : China

MOQ : 1pcs

Payment Terms : T/T

Delivery Time : fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production

Packaging Details : vacuum

PCB Name : ENIG Ceramic Base Circuit

Marterial : High TG FR4; Ceramic base material

Surface finished : LF-HASL, OSP...

Board Thickness : 0.4mm-4.0mm

Copper thickness : 18um-105um

Solder mask : green;blue;black;red...

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OSP HASL Multilayer Ceramic PCB Circuit Board High TG FR4 ISO9001 Approved​

Ceramic PCB Board ENIG Ceramic Base PCB Ceramic Base Material High Density Printed Circuit Board

ENIG Ceramic Base Circuit

Ceramic PCB have good high-frequency and electrical performance, and have high thermal conductivity, excellent chemical and thermal stability. Excellent corrosion resistance, it widely used in semiconductor and microelectronic circuit packaging pcb, High-brightness Led chip carrier board, automotive electronics and lighting components, high-power electronic component heat dissipation materials, etc.

Ceramic PCBs provide best source of reacting point for printed circuits due to two reasons, high thermal conductivity and low coefficient of thermal expansion (CTE). The ceramic PCB is highly unique and useful because it is a complete replacement of traditional printed circuit boards having simple structure and increased performance.

Characteristics of Ceramic PCB:


1. Ceramic printed circuit boards are excellent heat conductors.
2. Ceramic circuit boards are not easily eroded by chemicals.
3. Ceramic PCBs provide a high level of mechanical compatibility.
4. High-density outlining is simple on ceramic boards.
5. Their CTA component compliance is excellent.

tems Normal standard
Material FR-4;High TG FR-4; Ceramic base material
Layer NO. 1-20
Board Size 50mm*50mm-560mm*640mm
Board Thickness 0.4mm-4.0mm
Thickness Tolerance ±10%
Min Hole Size 0.15mm
Copper Thickness 18um-105um
Copper Plating hole 18um-30um
Min Trace Width 0.1mm
Min Space Width 0.1mm
Solder Mask Color green;blue;black;red...
Surfae Immersion gold, LF-HASL, OSP...
Outline profile CNC; V-CUT; Punching
Impedance Control ±10%
certificate ISO9001

OSP HASL Multilayer Ceramic PCB Circuit Board High TG FR4 ISO9001 Approved

FAQ:

Q1:Are you a factory or trade company?
A: Yes, we are the factory, we have independent quick turn prototype PCB manufacturing & big volume PCB production lines.

Q2:How about your PCB factory production capacity?
A: Our monthly production capacity is 50,000 square meter/month and 5000types/month.

Q3:If we have no PCB file/Gerber file, only have the PCB sample,can you produce it for me?
A: Yes,we could help you to clone the PCB. Just send the sample PCB to us, we could clone the PCB design and work out it.

Q4:How will you usually ship the PCB?
A: Usually for small packages, we will ship the boards by DHL,UPS,FedEx door to door service, we could use your shipping account to do collection or use our account to ship in DDU (import duty unpaid) delivery term.
For heavy goods more than 300kg, we may ship your PCB boards by ship or by air to save freight cost. Of course, if you have your own forwarder, we may contact them for dealing with your shipment.

Q5:What is your standard lead time for production?
A: Sample/prototype(less than 3sqm):
1-2 Layers: 3 to 5working days (fastest 24hours for quick turn services)
4-8 Layers: 7~12 working days (fastest 48hours for quick turn services)
Mass production (less than 200sqm):
1-2 Layers:7 to 12 working days
4-8 Layers:10 to 15 working days


Product Tags:

OSP HASL Multilayer Ceramic PCB

      

ISO9001 Multilayer Ceramic PCB

      

ISO9001 High TG PCB

      
China OSP HASL Multilayer Ceramic PCB Circuit Board High TG FR4 ISO9001 Approved wholesale

OSP HASL Multilayer Ceramic PCB Circuit Board High TG FR4 ISO9001 Approved Images

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